Patent Assignment
Reel/Frame 035569/0620
Assignment of Assignor's Interest
Recorded: 2015-05-05
Pages: 8
Assignors
GAO, GUILIAN
Executed: 2015-05-05
UZOH, CYPRIAN EMEKA
Executed: 2015-05-05
WANG, LIANG
Executed: 2015-05-05
WOYCHIK, CHARLES G.
Executed: 2015-05-05
SHEN, HONG
Executed: 2015-05-05
AGRAWAL, AKASH
Executed: 2015-05-05
KATKAR, RAJESH
Executed: 2015-05-05
SITARAM, ARKALGUD R.
Executed: 2015-05-05
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Integrated Circuit Assemblies with Rigid Layers Used for Protection Against Mechanical Thinning and for Other Purposes, and Methods of Fabricating Such Assemblies
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Change of Name
Sep 13, 2024
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 069021/0578 →
Assignment of Assignor's Interest
Sep 13, 2024
From: GAO, GUILIAN; UZOH, CYPRIAN EMEKA; WANG, LIANG; WOYCHIK, CHARLES G.
To: INVENSAS CORPORATION
Reel/Frame 068588/0234 →
Change of Name
Sep 13, 2024
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 068952/0759 →