IP Library › Assignment 068952/0759
Patent Assignment
Reel/Frame 068952/0759

Change of Name

Recorded: 2024-09-13 Pages: 5
Assignor
INVENSAS LLC
Executed: 2022-08-15
Assignee
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties (2)
Circuit Assemblies with Multiple Interposer Substrates, and Methods of Fabrication
Patent: 9,402,312 →
Application: 14/275,741 →
Publication: US 2015/0327367
Integrated Circuit Assemblies with Rigid Layers Used for Protection Against Mechanical Thinning and for Other Purposes, and Methods of Fabricating Such Assemblies
Patent: 9,548,273 →
Application: 14/704,714 →
Publication: US 2016/0163650
Related Assignments (8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 2, 2014
From: SHEN, HONG; SUN, ZHUOWEN; WOYCHIK, CHARLES G.; SITARAM, ARKALGUD R.
To: INVENSAS CORPORATION
Reel/Frame 033011/0853 →
Assignment of Assignor's Interest May 5, 2015
From: GAO, GUILIAN; UZOH, CYPRIAN EMEKA; WANG, LIANG; WOYCHIK, CHARLES G.
To: INVENSAS CORPORATION
Reel/Frame 035569/0620 →
Security Interest Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Assignment of Assignor's Interest Sep 13, 2024
From: SHEN, HONG; SUN, ZHUOWEN; WOYCHIK, CHARLES G.; SITARAM, ARKALGUD R.
To: INVENSAS CORPORATION
Reel/Frame 068588/0416 →
Assignment of Assignor's Interest Sep 13, 2024
From: GAO, GUILIAN; UZOH, CYPRIAN EMEKA; WANG, LIANG; WOYCHIK, CHARLES G.
To: INVENSAS CORPORATION
Reel/Frame 068588/0234 →
Change of Name Sep 13, 2024
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 069021/0578 →