Patent Assignment
Reel/Frame 035578/0868
Assignment of Assignor's Interest
Recorded: 2015-05-06
Pages: 2
Assignors
WU, WEI-CHENG
Executed: 2010-05-03
HOU, SHANG-YUN
Executed: 2010-05-03
JENG, SHIN-PUU
Executed: 2010-05-12
YU, CHEN-HUA
Executed: 2010-05-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method of Manufacturing Package System
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.