Patent Assignment
Reel/Frame 035583/0846
Assignment of Assignor's Interest
Recorded: 2015-05-07
Pages: 4
Assignor
IM, YUNHYEOK
Executed: 2015-02-14
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method for Manufacturing the Same