Patent Assignment
Reel/Frame 035614/0497
Assignment of Assignor's Interest
Recorded: 2015-05-12
Pages: 2
Assignor
CHI, SHYH-AN
Executed: 2015-04-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Stacked Die Semiconductor Device with Interconnect Structure