Patent Assignment
Reel/Frame 035621/0215
Assignment of Assignor's Interest
Recorded: 2015-05-12
Pages: 3
Assignor
PAN, SHAOWEI
Executed: 2008-07-08
Assignee
LEMKO CORPORATION
ONE PIERCE PLACE, SUITE 700, ITASCA, ILLINOIS, 60143
Covered Property
(1)
Oamp for Distributed Mobile Architecture
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 11, 2008
From: PAN, SHAOWEI
To: LEMKO, CORPORATION
Reel/Frame 021227/0025 →
Covenant Not to Sue
Feb 21, 2012
From: LEMKO CORPORATION
To: MOTOROLA SOLUTIONS, INC.
Reel/Frame 027744/0637 →
Patent Security Agreement
Mar 25, 2025
From: LEMKO CORPORATION
To: PICCADILLY PATENT FUNDING LLC, AS SECURITY HOLDER
Reel/Frame 070613/0796 →