Patent Assignment
Reel/Frame 035650/0211
Assignment of Assignor's Interest
Recorded: 2015-05-15
Pages: 4
Assignors
LIN, HUNG-JEN
Executed: 2012-03-12
WANG, TSUNG-DING
Executed: 2012-03-12
LEE, CHIEN-HSIUN
Executed: 2012-03-15
LU, WEN-HSIUNG
Executed: 2012-03-12
CHENG, MING-DA
Executed: 2012-03-12
LIU, CHUNG-SHI
Executed: 2012-03-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method of Forming Package Assembly