Patent Assignment
Reel/Frame 035654/0044
Assignment of Assignor's Interest
Recorded: 2015-05-15
Pages: 4
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Chip-On-Film Package Having Bending Part