Patent Assignment
Reel/Frame 035659/0764
Assignment of Assignor's Interest
Recorded: 2015-05-18
Pages: 3
Assignee
DOWA METALTECH CO., LTD.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 101-8617, JAPAN
Covered Property
(1)
Metal/Ceramic Bonding Substrate and Method for Producing Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.