Assignment of Assignor's Interest

Recorded: 2015-05-18 Pages: 3

Assignors

AOKI, HIROTO

Executed: 2015-04-13

KANECHIKA, YUKIHIRO

Executed: 2015-04-20

SUGAWARA, KEN

Executed: 2015-04-20

TAKEDA, YASUKO

Executed: 2015-04-24

Assignee

TOKUYAMA CORPORATION

1-1, MIKAGE-CHO, SHUNAN-SHI, YAMAGUCHI, 745-8648, JAPAN

Covered Property (1)

Metal/Ceramic Bonding Substrate and Method for Producing Same

Patent: 9,944,565 →

Application: 14/443,505 →

Publication: US 2015/0284296

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.