Patent Assignment
Reel/Frame 035678/0650
Assignment of Assignor's Interest
Recorded: 2015-05-20
Pages: 2
Assignors
CHENG, JUNG WEI
Executed: 2014-02-14
WANG, TSUNG-DING
Executed: 2014-02-14
LEE, CHIEN-HSUN
Executed: 2014-02-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSINC-CHU, 300-77, TAIWAN
Covered Property
(1)
Concentric Bump Design for the Alignment in Die Stacking