Patent Assignment
Reel/Frame 035704/0074
Assignment of Assignor's Interest
Recorded: 2015-05-25
Pages: 4
Assignors
HU, HONG
Executed: 2015-03-23
SHU, QINGMING
Executed: 2015-03-23
ZHANG, SAI
Executed: 2015-03-23
ZHANG, JIANJUN
Executed: 2015-03-23
LIU, JIANG
Executed: 2015-03-23
Assignee
GIGADEVICE SEMICONDUCTOR (BEIJING) INC.
SUITE 01-15, A12, TIANGONG BUILDING XUEYUAN ROAD NO. 30, HAIDIAN DISTRICT, BEIJING, 100083, CHINA
Covered Property
(1)
Enhanced Flash Chip and Method for Packaging Chip
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.