Patent Assignment
Reel/Frame 035737/0649
Assignment of Assignor's Interest
Recorded: 2015-05-28
Pages: 2
Assignee
SENJU METAL INDUSTRY CO., LTD.
23, SENJU-HASHIDO-CHO, ADACHI-KU, TOKYO, 120-8555, JAPAN
Covered Property
(1)
Electronic Device Including Soldered Surface-Mount Component