Patent Assignment
Reel/Frame 035740/0580
Assignment of Assignor's Interest
Recorded: 2015-05-29
Pages: 4
Assignor
DU, MAOHUA
Executed: 2015-05-22
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Having Heat Dissipating Member