Patent Assignment
Reel/Frame 035740/0603
Assignment of Assignor's Interest
Recorded: 2015-05-29
Pages: 3
Assignor
ZHANG, JOHN HONGGUANG
Executed: 2015-05-29
Assignee
STMICROELECTRONICS, INC.
750 CANYON DRIVE, SUITE 300, MAIL STATION 2346, COPPELL, TEXAS, 75019
Covered Property
(1)
Via, Trench or Contact Structure in the Metallization, Premetallization Dielectric or Interlevel Dielectric Layers of an Integrated Circuit
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.