IP Library › Assignment 068814/0783
Patent Assignment
Reel/Frame 068814/0783

Assignment of Assignor's Interest

Recorded: 2024-10-07 Pages: 6
Assignor
STMICROELECTRONICS, INC.
Executed: 2024-10-03
Assignee
STMICROELECTRONICS INTERNATIONAL N.V.
CHEMIN DU CHAMP-DES-FILLES 39, PLAN-LES-OUATES, GENEVA, 1228, SWITZERLAND
Covered Properties (10)
Integrated Tensile Strained Silicon Nfet and Compressive Strained Silicon-Germanium Pfet Implemented in Finfet Technology
Patent: 9,607,901 →
Application: 14/705,291 →
Publication: US 2016/0329253
Integrated Tensile Strained Silicon Nfet and Compressive Strained Silicon-Germanium Pfet Implemented in Finfet Technology
Application: 16/180,223 →
Publication: US 2019/0081079
Via, Trench or Contact Structure in the Metallization, Premetallization Dielectric or Interlevel Dielectric Layers of an Integrated Circuit
Patent: 9,640,483 →
Application: 14/724,975 →
Publication: US 2016/0351500
Via, Trench or Contact Structure in the Metallization, Prematallization Dielectric or Interlevel Dielectric Layers of an Integrated Circuit
Application: 15/464,487 →
Publication: US 2017/0194244
Sensing an Icmfb Output to Detect Functional State of a Mems Sensor
Application: 15/599,234 →
Publication: US 2018/0335446
Sensing an Icmfb Output to Detect Functional State of a Mems Sensor
Application: 17/472,126 →
Publication: US 2021/0405085
Method, System, and Circuits for Rf Low-Latency, Multiple Priority Communication Using Defined Transmission Windows
Application: 17/542,274 →
Publication: US 2023/0179392
Title Not Available
Application: 18/745,315 →
On-Sensor Anomaly Detector
Application: 18/738,762 →
Systems, Apparatuses, and Methods to Control a Bridgeless Totem Pole Power Factor Correction (Pfc) Circuit
Application: 18/753,705 →
Related Assignments (8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest May 6, 2015
From: LIU, QING; MORIN, PIERRE
To: STMICROELECTRONICS, INC.
Reel/Frame 035576/0209 →
Assignment of Assignor's Interest May 29, 2015
From: ZHANG, JOHN HONGGUANG
To: STMICROELECTRONICS, INC.
Reel/Frame 035740/0603 →
Assignment of Assignor's Interest Jun 2, 2017
From: CHOI, DAVY; HU, YAMU; FANG, DEYOU
To: STMICROELECTRONICS, INC.
Reel/Frame 042576/0825 →
Assignment of Assignor's Interest Jun 14, 2022
From: GENTILI, MAURIZIO
To: STMICROELECTRONICS, INC.
Reel/Frame 060385/0172 →
Assignment of Assignor's Interest Jun 13, 2024
From: SAHA, SWAPNIL SAYAN; CHOWDHARY, MAHESH
To: STMICROELECTRONICS, INC.
Reel/Frame 067720/0237 →
Assignment of Assignor's Interest Jun 17, 2024
From: DELEULE, ARNAUD
To: STMICROELECTRONICS, INC.
Reel/Frame 067746/0043 →
Assignment of Assignor's Interest Jul 1, 2024
From: ADEMANE, HARSHA; ATTANASIO, ROSARIO
To: STMICROELECTRONICS, INC.
Reel/Frame 067881/0640 →
Assignment of Assignor's Interest Aug 19, 2024
From: CHOI, DAVY; HU, YAMU; FANG, DEYOU
To: STMICROELECTRONICS, INC.
Reel/Frame 068325/0121 →