IP Library › Assignment 035745/0097
Patent Assignment
Reel/Frame 035745/0097

Assignment of Assignor's Interest

Recorded: 2015-05-29 Pages: 2
Assignors
CHEN, HSIEN-WEI
Executed: 2015-05-18
CHEN, JIE
Executed: 2015-05-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Discrete Polymer in Fan-Out Packages
Patent: 9,666,502 →
Application: 14/690,081 →
Publication: US 2016/0307872