Patent Assignment
Reel/Frame 035753/0551
Assignment of Assignor's Interest
Recorded: 2015-06-01
Pages: 5
Assignors
KIM, CHIN-KWAN
Executed: 2015-05-20
KUMAR, RAJNEESH
Executed: 2015-05-20
NOVESKI, VLADIMIR
Executed: 2015-05-20
FU, JIE
Executed: 2015-05-20
SYED, AHMER RAZA
Executed: 2015-05-20
SHAH, MILIND PRAVIN
Executed: 2015-05-20
BCHIR, OMAR JAMES
Executed: 2015-05-20
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121-1714
Covered Property
(1)
Reinforced Wafer Level Package Comprising a Core Layer for Reducing Stress in a Solder Joint and Improving Solder Joint Reliability