Patent Assignment
Reel/Frame 035797/0484
Assignment of Assignor's Interest
Recorded: 2015-06-05
Pages: 4
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOSIUNG, TAIWAN
Covered Property
(1)
Embedded Component Package Structure and Method of Manufacturing the Same