Patent Assignment
Reel/Frame 035798/0214
Assignment of Assignor's Interest
Recorded: 2015-06-05
Pages: 4
Assignor
CHO, YUN-RAE
Executed: 2015-05-22
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Having Cascaded Chip Stack