Patent Assignment
Reel/Frame 035806/0377
Assignment of Assignor's Interest
Recorded: 2015-06-09
Pages: 5
Assignors
TIAN, DEWEN
Executed: 2015-05-13
MING CHEUNG, YIU
Executed: 2015-05-12
LI, MING
Executed: 2015-05-13
Assignee
ASM TECHNOLOGY SINGAPORE PTE LTD
2 YISHUN AVENUE 7, SINGAPORE, 768924, SINGAPORE
Covered Property
(1)
Die Bonding with Liquid Phase Solder
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.