Assignment of Assignor's Interest

Recorded: 2015-06-09 Pages: 4

Assignor

SASAKI, YUZO

Executed: 2015-06-03

Assignee

SHOWA DENKO K.K.

13-9, SHIBADAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN

Covered Property (1)

Method for Manufacturing Sic Substrate

Patent: 9,390,924 →

Application: 14/650,596 →

Publication: US 2015/0318174

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.