Patent Assignment
Reel/Frame 035823/0450
Assignment of Assignor's Interest
Recorded: 2015-06-11
Pages: 3
Assignee
XINTEC INC.
9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK, JHONGLI DIST., TAOYUAN CITY, 32062, TAIWAN
Covered Property
(1)
Chip Device Packages and Fabrication Methods Thereof