Patent Assignment
Reel/Frame 035835/0577
Assignment of Assignor's Interest
Recorded: 2015-06-15
Pages: 4
Assignor
KIM, YEONGSEOK
Executed: 2015-03-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Same