Patent Assignment
Reel/Frame 035852/0497
Assignment of Assignor's Interest
Recorded: 2015-06-17
Pages: 3
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-300, 300, TAIWAN
Covered Property
(1)
Semiconductor Package Assemblies with System-on-Chip (Soc) Packages