Patent Assignment
Reel/Frame 035857/0577
Assignment of Assignor's Interest
Recorded: 2015-06-18
Pages: 2
Assignors
SHIMIZU, NORIYOSHI
Executed: 2015-04-09
OI, KIYOSHI
Executed: 2015-04-09
SHIMIZU, YUICHIRO
Executed: 2015-04-09
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO-KEN, 381-2287, JAPAN
Covered Property
(1)
Wiring Substrate, Semiconductor Device, and Method for Manufacturing Wiring Substrate