Patent Assignment
Reel/Frame 035859/0683
Assignment of Assignor's Interest
Recorded: 2015-06-18
Pages: 3
Assignee
IBIDEN CO., LTD.
2-1, KANDA-CHO, OGAKI-SHI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Printed Wiring Board, Semiconductor Package, and Method for Manufacturing Printed Wiring Board