Patent Assignment
Reel/Frame 035862/0218
Assignment of Assignor's Interest
Recorded: 2015-06-18
Pages: 2
Assignors
TUNG, SZU-PING
Executed: 2015-02-16
CHI, CHIH-CHIEN
Executed: 2015-02-16
SU, HUNG-WEN
Executed: 2015-02-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method of Forming an Interconnect Structure Having an Air Gap and Structure Thereof