Patent Assignment
Reel/Frame 035862/0789
Assignment of Assignor's Interest
Recorded: 2015-06-18
Pages: 4
Assignors
HUANG, HUI-MIN
Executed: 2015-02-09
LIN, CHIH-WEI
Executed: 2015-02-09
TSAI, TSAI-TSUNG
Executed: 2015-02-09
CHENG, MING-DA
Executed: 2015-02-10
LIU, CHUNG-SHI
Executed: 2015-02-10
YU, CHEN-HUA
Executed: 2015-02-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Semiconductor Package System and Method