IP Library › Assignment 035874/0397
Patent Assignment
Reel/Frame 035874/0397

Assignment of Assignor's Interest

Recorded: 2015-06-22 Pages: 2
Assignor
FUKUDA, HIROSHI
Executed: 2015-05-29
Assignee
HITACHI HIGH-TECHNOLOGIES CORPORATION
24-14, NISHI SHIMBASHI 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property (1)
Pattern Shape Evaluation Method, Semiconductor Device Manufacturing Method, and Pattern Shape Evaluation Device
Patent: 9,449,790 →
Application: 14/652,624 →
Publication: US 2016/0035538
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name and Address Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →