IP Library › Assignment 035878/0574
Patent Assignment
Reel/Frame 035878/0574

Assignment of Assignor's Interest

Recorded: 2015-06-22 Pages: 3
Assignors
LAM, KAN WAE
Executed: 2015-06-11
UMALI, POMPEO V.
Executed: 2015-06-11
YEUNG, SHUN TIK
Executed: 2015-06-11
LEUNG, CHI HO
Executed: 2015-06-11
SHUM, CHI LING
Executed: 2015-06-11
Assignee
NXP B.V.
HIGH TECH CAMPUS 60, EINDHOVEN, NL-5656 AG, NETHERLANDS
Covered Property (1)
Built-Up Lead Frame Package and Method of Making Thereof
Patent: 9,640,463 →
Application: 14/746,612 →
Publication: US 2016/0372403
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 8, 2016
From: NXP B.V.
To: NEXPERIA B.V.
Reel/Frame 039610/0734 →
Release of Security Interest Feb 13, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 048328/0964 →