Patent Assignment
Reel/Frame 035886/0866
Assignment of Assignor's Interest
Recorded: 2015-06-10
Pages: 7
Assignors
HAN, SANG-UK
Executed: 2015-04-27
PARK, SEUNGWON
Executed: 2015-04-27
KANG, UN-BYOUNG
Executed: 2015-04-27
CHO, TAEJE
Executed: 2015-04-27
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Fabricating the Same