Patent Assignment
Reel/Frame 035886/0922
Assignment of Assignor's Interest
Recorded: 2015-06-11
Pages: 14
Assignors
HO, HERBERT L.
Executed: 2015-05-27
KUSABA, NAOYOSHI
Executed: 2015-05-28
NUMMY, KAREN A.
Executed: 2015-05-27
RADENS, CARL J.
Executed: 2015-05-27
TODI, RAVI M.
Executed: 2015-05-22
WANG, GENG
Executed: 2015-05-27
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Structure and Method of Forming Enhanced Array Device Isolation for Implanted Plate Edram
Application:
14/736,651 →
Publication:
US 2015/0279844
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 3, 2016
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GLOBALFOUNDRIES U.S. 2 LLC
Reel/Frame 037409/0869 →
Assignment of Assignor's Interest
Jan 15, 2016
From: GLOBALFOUNDRIES U.S. 2 LLC; GLOBALFOUNDRIES U.S. INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 037542/0087 →
Release of Security Interest
May 12, 2021
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 056987/0001 →