Patent Assignment
Reel/Frame 035887/0101
Assignment of Assignor's Interest
Recorded: 2015-06-23
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2015-03-16
CHENG, JUNG WEI
Executed: 2015-03-16
WANG, TSUNG-DING
Executed: 2015-03-16
LEE, CHIEN-HSUN
Executed: 2015-03-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6 SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Substrate Design for Semiconductor Packages and Method of Forming Same