Patent Assignment
Reel/Frame 035887/0514
Assignment of Assignor's Interest
Recorded: 2015-06-11
Pages: 9
Assignors
RODDER, MARK S.
Executed: 2015-06-09
OBRADOVIC, BORNA
Executed: 2015-06-10
SENGUPTA, RWIK
Executed: 2015-06-11
PALLE, DHARMENDAR REDDY
Executed: 2015-06-10
BOWEN, ROBERT C.
Executed: 2015-06-10
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuits with Si and Non-Si Nanosheet FET Co-Integration with Low Band-to-Band Tunneling and Methods of Fabricating the Same