IP Library Assignment 035898/0298
Patent Assignment
Reel/Frame 035898/0298

Assignment of Assignor's Interest

Recorded: 2015-06-24 Pages: 4
Assignor
LIU, HAI
Executed: 2015-06-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property (1)
Printed Circuit Board for Semiconductor Package
Patent: 9,504,152 →
Application: 14/748,970 →
Publication: US 2016/0005683