Printed circuit board for semiconductor package
A printed circuit board for a semiconductor package including a printed circuit board body, a plurality of ball lands on one surface of the printed circuit board body, a first plating layer on a portion of each of the ball lands, and a second plating layer on another portion of each of the ball lands may be provided. An upper surface of the first plating layer may be coplanar with an upper surface of the second plating layer.
1. A printed circuit board for a semiconductor package comprising:
a printed circuit board body;
a plurality of ball lands on one surface of the printed circuit board body;
a first plating layer on a portion of each of the ball lands; and
a second plating layer on another portion of each of the ball lands, an upper surface of the first plating layer being substantially coplanar with an upper surface of the second plating layer,
wherein the first plating layer and the second plating layer cover entire exposed upper surfaces of the ball lands.
2. The printed circuit board of claim 1 , wherein the first plating layer or the second plating layer has a single-layered structure or a multi-layered structure.
3. The printed circuit board of claim 1 , wherein at least one of the first plating layer and the second plating layer is made of a plurality of materials.
4. The printed circuit board of claim 1 , wherein the first plating layer includes at least one selected from the group consisting of Ni/Au, Ni/Pd/Au, Ni/Ag, Ni/Pd/Ag, Ni/Sn, Ni/Cu, and Ni/Pd.
5. The printed circuit board of claim 1 , wherein the second plating layer includes at least one selected from the group consisting of organic solderability preservative (OSP), Ag, Au, Pd, and Sn.
6. The printed circuit board of claim 1 , wherein when the printed circuit board is viewed from above, the first plating layer and the second plating layer are alternately arranged in a checkerboard pattern.
7. The printed circuit board of claim 1 , wherein when the printed circuit board is viewed from above, the first plating layer and the second plating layer have a circular shape.
8. The printed circuit board of claim 1 , wherein a surface where the first plating layer and the second plating layer form a concave-convex shape when viewed laterally.
9. The printed circuit board of claim 1 , wherein the ball lands, the first plating layer, and the second plating layer are electrically connected to one another.
10. A printed circuit board for a semiconductor package, the printed circuit board comprising:
a printed circuit board body including internal metal wirings;
a plurality of ball lands on one surface of the printed circuit board body, the ball lands electrically connected to the internal metal wirings;
a first plating layer on a portion of each of the ball lands; and
a second plating layer on another portion of each of the ball lands, the first plating layer and the second plating layer forming a concave-convex shape when viewed laterally,
wherein the first plating layer is a stack of different conductive metal layers.
11. The printed circuit board of claim 10 , wherein an upper surface of the first plating layer is higher than an upper surface of the second plating layer with respect to the printed circuit board body.
12. The printed circuit board of claim 10 , wherein
the ball land has a concave-convex shape having a convex portion and a concave portion, and
the first plating layer covers the concave portion of the ball land and the second plating layer fills the convex portion of the ball land.
13. The printed circuit board of claim 10 , wherein the first plating layer is configured to improve thermal cycle reliability and the second plating layer is configured to improve drop reliability.
14. A printed circuit board for a semiconductor package comprising:
a printed circuit board body;
a ball land on one surface of the printed circuit board body;
a plurality of first plating layers and a plurality of second plating layers on the ball land, the first plating layers and the second plating layers interleaving each other,
wherein each of the plurality of first and second plating layers is a stack of different conductive metal layers.
15. The printed circuit board of claim 14 , wherein the ball land includes a plurality of grooves defined therein and each of the grooves are at least partially filled with at least a portion of a corresponding one of the first plating layers.
16. The printed circuit board of claim 15 , wherein upper surfaces of the first plating layers are substantially coplanar with upper surfaces of the second plating layers.
17. The printed circuit board of claim 15 , wherein the stack of different conductive metal layers includes an upper layer and a lower layer, the lower layer fills a corresponding one of the grooves to provide a convex portion protruding from a top surface of the ball land, and the upper layer covers top and side surfaces of the convex portion.
18. The printed circuit board of claim 15 , wherein the second plating layers cover top and side surfaces of a plurality of convex portions of the ball land that are defined by the grooves.