Patent Assignment
Reel/Frame 035907/0067
Assignment of Assignor's Interest
Recorded: 2015-06-25
Pages: 4
Assignee
MITSUBISHI MATERIALS CORPORATION
3-2, OTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, 100-8117, JAPAN
Covered Property
(1)
Power Module Substrate, Power Module Substrate with Metal Part, Power Module with Metal Part, Method for Producing Power Module Substrate, and Method for Producing Power Module Substrate with Metal Part