Patent Assignment
Reel/Frame 035925/0692
Assignment of Assignor's Interest
Recorded: 2015-06-29
Pages: 3
Assignors
KIM, DONG SUN
Executed: 2015-06-26
RYU, SUNG WUK
Executed: 2015-06-26
SEO, HYUN SEOK
Executed: 2015-06-26
LEE, JI HAENG
Executed: 2015-06-26
Assignee
LG INNOTEK CO., LTD.
SEOUL SQUARE, 416, HANGANG-DAERO, JUNG-GU, SEOUL, 100-714, KOREA, REPUBLIC OF
Covered Property
(1)
Printed Circuit Board and Package Substrate