Patent Assignment
Reel/Frame 035959/0412
Assignment of Assignor's Interest
Recorded: 2015-06-30
Pages: 10
Assignors
JUNG, KYU-DONG
Executed: 2015-06-29
KIM, JUNG-HWAN
Executed: 2015-06-25
LEE, DONG-GIL
Executed: 2015-06-25
CHO, TAE-JE
Executed: 2015-06-25
CHOI, KWANG-CHUL
Executed: 2015-06-25
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Initiator and Method for Debonding Wafer Supporting System