Patent Assignment
Reel/Frame 035963/0025
Assignment of Assignor's Interest
Recorded: 2015-06-24
Pages: 8
Assignors
JOW, UEI-MING
Executed: 2015-05-18
SONG, YOUNG KYU
Executed: 2015-06-05
LEE, JONG-HOON
Executed: 2015-06-12
ZHANG, XIAONAN
Executed: 2015-06-05
VELEZ, MARIO FRANCISCO
Executed: 2015-06-05
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121-1714
Covered Property
(1)
Substrate Comprising Stacks of Interconnects, Interconnect on Solder Resist Layer and Interconnect on Side Portion of Substrate