Patent Assignment
Reel/Frame 035967/0923
Assignment of Assignor's Interest
Recorded: 2015-07-02
Pages: 4
Assignors
WANG, CHI-CHUAN
Executed: 2015-06-29
HUANG, PO-SHENG
Executed: 2015-06-29
WU, SHANG-HSUANG
Executed: 2015-06-29
LIN, TSUNG-CHING
Executed: 2015-06-29
CHUNG, WEN-YEN
Executed: 2015-06-29
CHEN, JHIH-HAO
Executed: 2015-06-29
Assignee
CORETRONIC CORPORATION
NO. 11, LI-HSIN RD., HSINCHU SCIENCE PARK,, HSIN-CHU, 300, TAIWAN
Covered Property
(1)
Heat Dissipating Module Having Turbulent Structures