IP Library Assignment 036007/0727
Patent Assignment
Reel/Frame 036007/0727

Assignment of Assignor's Interest

Recorded: 2015-07-07 Pages: 11
Assignors
DAS, RABINDRA N.
Executed: 2015-05-22
MURPHY, PETER G.
Executed: 2015-05-22
MAGOON, KAREN E.
Executed: 2015-05-22
KINAYMAN, NOYAN
Executed: 2015-06-02
BARBIERI, MICHAEL J.
Executed: 2015-06-01
HANCOCK, TIMOTHY M.
Executed: 2015-06-01
GOUKER, MARK A.
Executed: 2015-06-01
Assignee
MASSACHUSETTS INSTITUTE OF TECHNOLOGY
77 MASSACHUSETTS AVENUE, CAMBRIDGE, MASSACHUSETTS, 02139
Covered Property (1)
Interconnect Structures for Fine Pitch Assembly of Semiconductor Structures and Related Techniques
Patent: 9,786,633 →
Application: 14/694,540 →
Publication: US 2017/0098627