Patent Assignment
Reel/Frame 036015/0435
Assignment of Assignor's Interest
Recorded: 2015-07-07
Pages: 5
Assignors
PARK, JUNG KYU
Executed: 2015-05-07
KIM, WAN JONG
Executed: 2015-05-07
JUN, YOUNG GEUN
Executed: 2015-05-12
Assignee
SAMSUNG ELECTRONIC CO., LTD.
129, SAMGUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing Semiconductor Device Package