Patent Assignment
Reel/Frame 036036/0470
Assignment of Assignor's Interest
Recorded: 2015-07-09
Pages: 10
Assignors
HSU, CHIH-KAI
Executed: 2015-07-08
HUNG, YU-HSIANG
Executed: 2015-07-08
FU, SSU-I
Executed: 2015-07-08
JENQ, JYH-SHYANG
Executed: 2015-07-08
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Semiconductor Structure and Fabrication Method Thereof