IP Library › Assignment 036054/0059
Patent Assignment
Reel/Frame 036054/0059

Assignment of Assignor's Interest

Recorded: 2015-07-10 Pages: 4
Assignors
HU, HONG
Executed: 2015-06-24
SHU, QINGMING
Executed: 2015-06-24
ZHANG, SAI
Executed: 2015-06-24
ZHANG, JIANJUN
Executed: 2015-06-24
LIU, JIANG
Executed: 2015-06-24
PAN, RONGHUA
Executed: 2015-06-24
Assignee
GIGADEVICE SEMICONDUCTOR (BEIJING) INC.
SUITE 01-15, A12, TIANGONG BUILDING XUEYUAN ROAD NO. 30, HAIDIAN DISTRICT, BEIJING, 100083, CHINA
Covered Property (1)
Enhanced Flash Chip and Method for Packaging Chip
Patent: 9,728,520 →
Application: 14/760,207 →
Publication: US 2015/0348939
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name & Address Oct 13, 2022
From: GIGADEVICE SEMICONDUCTOR (BEIJING) INC.
To: GIGADEVICE SEMICONDUCTOR INC.
Reel/Frame 061668/0819 →