Patent Assignment
Reel/Frame 036055/0668
Assignment of Assignor's Interest
Recorded: 2015-07-10
Pages: 6
Assignors
JANG, HYE-YOUNG
Executed: 2015-05-29
JEON, CHANG-SEONG
Executed: 2015-04-05
JO, CHAJEA
Executed: 2015-06-05
CHO, TAEJE
Executed: 2015-06-05
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages and Methods for Fabricating the Same