Patent Assignment
Reel/Frame 036056/0816
Assignment of Assignor's Interest
Recorded: 2015-07-10
Pages: 3
Assignee
MRSI SYSTEMS, LLC
101 BILLERICA AVENUE, BLDG 3, NORTH BILLERICA, MASSACHUSETTS, 01862
Covered Property
(1)
System and Method for Thermo-Compression Bonding of High Bump Count Semiconductors
Application:
14/752,190 →
Publication:
US 2015/0380379
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.