IP Library Assignment 036066/0679
Patent Assignment
Reel/Frame 036066/0679

Assignment of Assignor's Interest

Recorded: 2015-07-13 Pages: 5
Assignors
BEER, GOTTFRIED
Executed: 2015-05-22
HOEGERL, JUERGEN
Executed: 2015-05-22
FOERG, RAIMUND
Executed: 2015-05-21
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-12, NEUBIBERG, 85579, GERMANY
Covered Property (1)
Semiconductor Device Having Solderable and Bondable Electrical Contact Pads
Patent: 9,496,237 →
Application: 14/715,778 →
Publication: US 2015/0333023