Patent Assignment
Reel/Frame 036071/0675
Assignment of Assignor's Interest
Recorded: 2015-07-13
Pages: 2
Assignors
SU, AN-JHIH
Executed: 2015-06-30
YEH, DER-CHYANG
Executed: 2015-06-30
CHEN, HSIEN-WEI
Executed: 2015-06-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Chip on Package Structure and Method